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  power transistor 1 publication date: june 2002 sjd00195bed 2SD1445A silicon npn epitaxial planar type for power amplification, power switching and low-voltage switching complementary to 2sb0948a (2sb948a) features ? low collector to emitter saturation voltage v ce(sat) ? high-speed switching ? satisfactory linearity of forward current transfer ratio h fe ? large collector current i c ? full-pack package which can be installed to the heat sink with one screw absolute maximum ratings t c = 25 c electrical characteristics t c = 25 c note) * : rank classification 10.0 0.2 5.5 0.2 7.5 0.2 16.7 0.3 0.7 0.1 14.0 0.5 solder dip (4.0) 0.5 +0.2 ?0.1 1.4 0.1 1.3 0.2 0.8 0.1 2.54 0.3 5.08 0.5 2 13 2.7 0.2 4.2 0.2 4.2 0.2 3.1 0.1 unit: mm 1: base 2: collector 3: emitter to-220f-a1 package parameter symbol rating unit collector to base voltage v cbo 50 v collector to emitter voltage v ceo 40 v emitter to base voltage v ebo 5v peak collector current i cp 20 a collector current i c 10 a collector power t c = 25 cp c 40 w dissipation t a = 25 c2 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector cutoff current i cbo v cb = 50 v, i e = 050 a emitter cutoff current i ebo v eb = 5 v, i c = 050 a collector to emitter voltage v ceo i c = 10 ma, i b = 040 v forward current transfer ratio h fe1 v ce = 2 v, i c = 0.1 a 45 h fe2 * v ce = 2 v, i c = 3 a 90 260 collector to emitter saturation voltage v ce(sat) i c = 10 a, i b = 0.33 a 0.6 v base to emitter saturation voltage v be(sat) i c = 10 a, i b = 0.33 a 1.5 v transition frequency f t v ce = 10 v, i c = 0.5 a, f = 10 mhz 120 mhz collector output capacitance c ob v cb = 10 v, i e = 0, f = 1 mhz 200 pf turn-on time t on i c = 3 a, i b1 = 0.1 a, i b2 = ? 0.1 a 0.3 s storage time t stg v cc = 20 v 0.4 s fall time t f 0.1 s rank q p h fe2 90 to 180 130 to 260 ordering can be made by the common rank (pq rank h fe2 = 90 to 260) in the rank classification. note) the part number in the parenthesis shows conventional part number.
2SD1445A 2 sjd00195bed t on , t stg , t f ? i c area of safe operation (aso) v be(sat) ? i c h fe ? i c f t ? i c p c ? t a i c ? v ce v ce(sat) ? i c 0 0 160 40 120 80 140 20 100 60 20 60 40 80 10 50 30 70 (1) (2) (3) ambient temperature t a ( c ) collector power dissipation p c ( w ) (1) t c = t a (2) with a 100 100 2 mm al heat sink (3) without heat sink (p c = 2.0 w) t c = 25 c i b = 100 ma 90 ma 80 ma 70 ma 60 ma 50 ma 40 ma 30 ma 20 ma 10 ma collector current i c (a) collector to emitter voltage v ce (v) 01234 6 5 0 2 4 6 8 10 0.1 0.3 1 3 10 30 collector to emitter saturation voltage v ce(sat) ( v ) collector current i c ( a ) 0.01 10 1 0.1 0.03 3 0.3 i c / i b = 20 t c = 100 c 25 c ? 25 c 0.1 0.3 1 3 10 30 base to emitter saturation voltage v be(sat) ( v ) collector current i c ( a ) 0.01 10 1 0.1 0.03 3 0.3 i c / i b = 20 t c = 100 c 25 c ? 25 c 0.1 0.3 1 3 10 30 1 1 000 100 10 3 300 30 v ce = 10 v t c = 100 c 25 c ? 25 c forward current transfer ratio h fe collector current i c ( a ) 0.01 10 0.1 1 0.03 0.3 3 0.1 v ce = 10 v f = 10 mhz t c = 25 c transition frequency f t ( mhz ) collector current i c ( a ) 1 10 100 0.3 3 30 300 1 000 switching time t on ,t stg ,t f ( s ) collector current i c ( a ) 0.01 0.03 0.1 0.3 1 3 10 30 100 05 4 3 2 1 pulsed t w = 1 ms duty cycle = 1% i c / i b = 30 (i b1 = ? i b2 ) v cc = 30 v t c = 25 c t stg t f t on 1 10 100 1 000 3 30 300 0.01 0.03 0.1 0.3 1 3 10 30 100 non repetitive pulse t c = 25 c t = 10 ms t = 1 s i cp dc i c collector current i c ( a ) collector to emitter voltage v ce ( v )
2SD1445A 3 sjd00195bed r th(t) ? t 10 ? 2 10 ? 1 1 10 10 3 10 2 10 ? 4 10 4 10 3 10 2 10 1 10 ? 1 10 ? 2 10 ? 3 (1) (2) (1)without heat sink (2)with a 100 100 2 mm al heat sink time t (s) thermal resistance r th(t) ( c/w)
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this book and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this book is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this book. (4) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this book are subject to change without no- tice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 may


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